Hortech Company - Hortech Co. - Professional provider of precision laser equipment and micron laser solution.

Hortech Co. high-quality Micron laser processing, precision laser processing, laser etching, laser cutting, laser drilling, laser engraving, laser machines, laser equipment, wafer dicing, wafer drilling, laser micro-perforation manufacturer from Taiwan | Hortech Company

Hortech Co. is a high-quality Micron laser processing, precision laser processing, laser etching, laser cutting, laser drilling, laser engraving, laser machines, laser equipment, wafer dicing, wafer drilling, laser micro-perforation manufacturer from Taiwan since 2006. Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Hortech Company

Hortech Co. - Professional provider of precision laser equipment and micron laser solution.

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Result 73 - 84 of 105
Laser Micro-etched Screw Surface - Employ the laser micro-etching technique to remove the coating on the surface or to employ heat treatment for surface microtexturization / microstructuration
Laser Micro-etched Screw Surface

Many rugged metal tools need to be of high hardness or high toughness, which prolongs their...

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Laser Micro-drilled Ceramic Fiber - Employ the ultra-fast laser to micro-drill composite ceramic fiber materials
Laser Micro-drilled Ceramic Fiber

Hortech employs laser micro-drilling to process or finish different materials. We develop and optimize...

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Laser Micro-cutting Composite Carbon Fiber/Ceramic Fiber/Glass Fiber in Heterotypic Shapes - Hortech employs the ultra-fast laser to cut light and hard composite materials in heterotypic shapes
Laser Micro-cutting Composite Carbon Fiber/Ceramic Fiber/Glass Fiber in Heterotypic Shapes

Composite materials, including ceramic fiber and carbon fiber, are light and hard. They could...

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Laser Micro-etched Titanium-Coated Glass - Laser micro-etching on metal films of glass materials
Laser Micro-etched Titanium-Coated Glass

Titanium-coated glass is micro-etched for customized patterns that will transmit light. This...

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Wire Peeling/Trimming - Exploit the wavelength or threshold of the laser to remove the exterior organic insulation materials
Wire Peeling/Trimming

High-quality wires consist of multi-layered materials. It is difficult to employ the conventional...

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Precision Micro-etched Surfaces of Inspection Measuring Instruments - Hortech employs the precision positioning to laser micro-etch the surface of metal rulers / scales
Precision Micro-etched Surfaces of Inspection Measuring Instruments

The surface of inspection instruments is laser micro-etched to produce precision measuring...

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3 um Direct-written Gratings on Reflective Lens or Thin Films - 3 µm Direct-written Gratings on Reflective Lens or Thin Films
3 um Direct-written Gratings on Reflective Lens or Thin Films

Hortech employs the laser direct writting etching technology to create ultrafine patterns with...

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Diamond Saw Blades - Employ ultrafast lasers to cut diamonds on diamond saw blades
Diamond Saw Blades

The diamond saw blade of a machine tool needs to be manufactured with high precision. Otherwise,...

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Laser Micro-cut Thermal Conductive Indium Foil in Processors - Hortech employs precision laser to cut the thermal conductive material - indium foil
Laser Micro-cut Thermal Conductive Indium Foil in Processors

Thermal conductive indium foil in processors, including CPUs, GPUs, and display LEDs can fill...

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3D Laser Printing Modules & Equipment - 3D Laser Printing Modules & Equipment
3D Laser Printing Modules & Equipment

Hortech provides 3D printing modules and equipment integration services. This 3D laser printing...

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Waterjet Laser Cutting and Drilling System - Waterjet Laser CNC Micro-cutting & Micro-drilling System
Waterjet Laser Cutting and Drilling System

Hortech is pleased to announce a new collaboration with an European manufacturer. Together...

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Waterjet Diamond Cutting System - Waterjet Diamond Cutting Machine
Waterjet Diamond Cutting System

This 3-axis system allows you to cut both natural and laboratory grown diamonds (CVD, HPHT)...

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Result 73 - 84 of 105

Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.

Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.