Hortech Company - Hortech Co. - Professional provider of precision laser equipment and micron laser solution.

Hortech Co. high-quality Micron laser processing, precision laser processing, laser etching, laser cutting, laser drilling, laser engraving, laser machines, laser equipment, wafer dicing, wafer drilling, laser micro-perforation manufacturer from Taiwan | Hortech Company

Hortech Co. is a high-quality Micron laser processing, precision laser processing, laser etching, laser cutting, laser drilling, laser engraving, laser machines, laser equipment, wafer dicing, wafer drilling, laser micro-perforation manufacturer from Taiwan since 2006. Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Hortech Company

Hortech Co. - Professional provider of precision laser equipment and micron laser solution.

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Result 61 - 72 of 110
Laser Micro-cutting Small Wafers - The wafer in the traditional size is laser cut into smaller pieces as a minifab’s process requires.
Laser Micro-cutting Small Wafers

The surface of the wafer must be clean and dust-free after the larger one is cut, so it is crucial...

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Laser Heterotypic Cutting on Silicon Wafer (Hyterotypic Wafer Dicing) - Cutting silicon wafers and pattern production for mechanical components
Laser Heterotypic Cutting on Silicon Wafer (Hyterotypic Wafer Dicing)

Silicon wafers have been widely adopted, so many semiconductor-related industries prefer to use these...

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Laser Micro-cutting Fingerprint IC Substrates - Cutting on IC substrates composed of composite materials
Laser Micro-cutting Fingerprint IC Substrates

To cut fingerprint IC substrates, Hortech coats substrates with protective films to reduce...

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Surface Micro-texturization of Copper Cooling Fins - Make the copper surface rough
Surface Micro-texturization of Copper Cooling Fins

The surface of copper cooling fins needs to be micro-texturized/micro-structured. Many metal...

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Laser Micro-drilled Silicon Wafer - Si Wafer Micro-drilling
Laser Micro-drilled Silicon Wafer

Material: Si, SiN, and other MEMS wafers. The hole diameter is smaller than 5 um.

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Laser Micro-cut Precision Spacers - To cut and produce precision spacers, Hortech employs high-energy laser, which is a cold precision micro-etching process after the shielding process
Laser Micro-cut Precision Spacers

As the 5G high-speed communication industry develops, the demand for MEMS finishing high-speed...

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Laser Micro-drilling on Stainless Steel - Hortech employs its laser micro-drilling technology to produce microvias on stainless steel.
Laser Micro-drilling on Stainless Steel

Hortech employs its laser micro-drilling technology to produce microvias on stainless steel....

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3D Laser Printing Services - 3D Laser Printing Services
3D Laser Printing Services

Hortech provides 3D laser printing services that mass produce parts and products in consumer...

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Invisible Laser Engraved Patterns on Light-control Acrylic - Hortech empploys its laser engraving technology to create its logo on a thin, transparent plate.
Invisible Laser Engraved Patterns on Light-control Acrylic

Hortech can laser engrave invisible patterns on specific materials for you. You may ask us to engrave...

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Aluminum Heat Sink with High Efficiency - Aluminum Heat Sink with High Efficiency
Aluminum Heat Sink with High Efficiency

Hortech can manufacture heat sinks in different shapes for our clients. The minimum linewidth...

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Laser Micro-Engraved Miniaturized QR Codes on Rings - Miniaturized, tiny QR codes on stainless steel rings for pet identification and animal traceability
Laser Micro-Engraved Miniaturized QR Codes on Rings

Hortech used its self-developed laser machine to laser micro-engrave miniaturized, tiny QR codes...

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Laser Micro-drilled Mo Parts - Laser micro-drilled Mo parts for electron microscopes
Laser Micro-drilled Mo Parts

Hortech implements laser micro-drilling on Mo, which are critical parts of electron microscopes....

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Result 61 - 72 of 110

Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.

Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.