Hortech's Current State
Hortech launches two products to enter into the markets and expands the applications of these products
Hortech Company has successfully mass produced high-resolution optical graduation scales based on its self-developed micron laser technologies. It has obtained a long-term OEM order from an European company and helped release the latter's new angular encoders. Hortech continuously produces the latest scales and enters into the precision machinery market. Additionally, Hortech just launches the ultrafast DUV deep ultraviolet laser machines with large power. These machines are capable of implementing multiple processes for diverse applications. Specifically, these can be used for: (1) The 3D silicon stacking and advanced packaging of semiconductors, including micro-drilling on ABF and BT substrates; (2) Power MOSFET circuit by laser direct micro-etching; (3) The lift-off, mass transfer, and micro-cutting LEDs in the MicroLED production process, together with plasma vertical cutting machines, can replace the stealth wafer dicing process. The semiconductor foundries and display manufacturing plants can introduce these machines to upgrade their production lines for higher yield rates and better products. Hortech is working with a Taiwanese MicroLED wafer foundry on trials. Furthermore, Hortech works with a Swiss manufacturer to launch the waterjet laser machines, which can be employed to perform precision cutting and drilling on metal and hard materials, including diamond blades, Si wafers, SiC wafers, GaN wafers, etc. Hortech is also applying its laser technologies to produce biomedical tools and gadgets.
If you are interested in investing in Hortech and growing with us, please contact us at e-sales@hortek.com.tw or through Line (ID: laserexp).
