Several different types of precision laser machines are used to perform laser processing at the micron level, including: (1) The laser etching machine: It removes the upper layer of the substrate, or coats the upper layer with a specific material and then implements the etching process according to the client’s request and/or the pattern the client provides. The width of the isolation line can be at the micron level, which is invisible to the naked eye. This allows our clients design ultracompact or miniaturized products. (2) The laser drilling machine: It employs lasers for micro-perforations or to create blind holes on different types of materials, including insulating ones, hard and brittle ones, or functional ones. It then maps the position of the via holes to the masking precision. This machine was designed in response to the tremendous demands in advanced semiconductor packaging. The above process can be applied to create medical microfluidic channels or filters. (3) The laser cutting machine: It is mainly used to cut the material of the substrate into grains after various electromechanical functions are generated. This machine can finish diverse types of materials, including ceramics, glass, wafers, organic materials, metal flakes, and so on. The width of the cutting line needs to be minimized to save the above material, but also has many cutting limitations to improve laser cutting skills. Additionally, these materials need to be handled by the cold process without the thermal effect. The cutting line needs to be seamless and at the micron level. Precision laser cutting is an excellent process for dicing semiconductor wafers or power semiconductor chips.

• With Micron or submicron laser focuser.
• Dust-free, cold processing.
• Process development for non-standardized laser machines.